Kort: Discover the 12V9 150*20*31.75*10mm D30 C125 Resin Bond Diamond Grinding Wheel, designed for precision grinding of carbide tools, ceramic components, and semiconductor materials. This high-quality grinding wheel features diamond abrasives for ultra-hardness and wear resistance, with a resin binder for elasticity and heat dissipation. Perfect for tool grinders and cylindrical grinders.
Gerelateerde Productkenmerken:
12V9 cup wheel shape for precision grinding applications.
150mm outer diameter (D) and 20mm thickness (T) for versatile use.
31.75mm inner hole diameter (H) ensures compatibility with standard machines.
10mm abrasive width (W) for precise material removal.
D30-diamanten slijpkorrels (G) bieden een zeer hoge hardheid en slijtvastheid.
C125 diamond concentration (C) for optimal performance.
Resin binder (phenolic, polyimide, or epoxy) offers elasticity and heat dissipation.
Aanpasbare maten beschikbaar om aan specifieke eisen te voldoen.
FAQ's:
Welke materialen kan de 12V9 Hars Bond Diamant slijpwiel verwerken?
Dit slijpwiel is ideaal voor het verwerken van carbide-gereedschappen, keramische onderdelen en halfgeleidermaterialen.
What machine tools are compatible with this grinding wheel?
It is suitable for use with tool grinders and cylindrical grinders.
Can the grinding wheel be customized to different sizes?
Yes, we offer customization for other sizes based on your specific requirements.